BAV70DXV6T5G
http://onsemi.com
4
PACKAGE DIMENSIONS
HE
DIM MIN NOM MAX
MILLIMETERS
A
0.50 0.55 0.60
b
0.17 0.22 0.27
C
D
1.50 1.60 1.70
E
1.10 1.20 1.30
e
0.5 BSC
L
0.10 0.20 0.30
1.50 1.60 1.70
0.020 0.021 0.023
0.007 0.009 0.011
0.059 0.062 0.066
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN NOM MAX
INCHES
SOT?563, 6 LEAD
CASE 463A
ISSUE F
e
0.08 (0.003)
M
X
Y
b
6 5 PL
A
C
?X?
?Y?
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
D
E
12 3
4
5
L
6
1.35
0.0531
0.5
0.0197
0.0197
SCALE 20:1
mm
inches
0.5
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
0.08 0.12 0.18
0.003 0.005 0.007
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BAV70DXV6T1/D
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